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CGHV35400

Wolfspeed RF CGHV37400F flange package
400-W; 2900 – 3500-MHz; 50-Ohm Input/Output Matched; GaN HEMT for S-Band Radar Systems
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The CGHV35400F1 is a gallium-nitride (GaN) fully matched IMFET housed in a thermally enhanced air cavity package. Operating at 50V, the device is capable of 500W of pulsed output power, with 2mS pulse lengths at 20% duty cycle.

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Frequency Min
Frequency Max
Peak Output Power
Gain
Efficiency
Operating Voltage
Form
Package Type
CGHV35400F-AMP
Yes
GaN on SiC
2.9 GHz
3.5 GHz
400 W
11 dB
60%
50 V
Evaluation Board
Flange
CGHV35400F
Yes
GaN on SiC
2.9 GHz
3.5 GHz
400 W
11 dB
60%
50 V
Packaged Discrete Transistor
Flange
CGHV35400F1
Yes
GaN on SiC
2.9 GHz
3.5 GHz
500 W
12 dB
60%
50 V
Packaged Discrete Transistor
Flange
Features
  • 2.9 – 3.5 GHz Operation
  • 500 W Typical Output Power
  • 11 dB Power Gain
  • 70% Typical Drain Efficiency
  • 50 Ohm Internally Matched
  • <0.3 dB Pulsed Amplitude Droop
Applications
  • S-Band Radar amplifiers
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Technical Papers & Articles
by Raymond S. Pengelly – William Pribble – Thomas Smith
This Simulation of power amplifiers (PAs) for modern wireless base station and small cell systems is an essential part of the design process. At a cell site – the PA consumes the bulk of the dc power – generates the most heat – and thus represents the greatest operational cost. Maximum PA efficiency is a necessity to manage these costs – which is a sizeable challenge in a PA that also must be highly linear to support the complex multilevel modulation types and wide bandwidths used for current and developing wireless transmission standards. Accurate simulation allows the PA designer to meet these challenges by exploring the available design options and then optimizing the circuit that is selected for the application.
Technical Papers & Articles
by Donald A. Gajewski – Scott Sheppard – Simon Wood – Jeff B. Barner – Jim Milligan – and John Palmour.
This paper discusses the reliability performance of Wolfspeed GaN/AlGaN high electron mobility transistor (HEMT) MMIC released process technologies – fabricated on 100 mm high purity semi-insulating (HPSI) 4H-SiC substrates.
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Knowledge Center

RF
|
Aerospace & Defense

Thermal Considerations for High-Power GaN RF Amplifiers

Many RF applications require very long lifetimes with typical military and telecom use cases demanding more than 10 years of operation. Junction temperature Tj, or the temperature of the base semiconductor in the device, plays an important role in device reliability as does the substrate material in keeping the base semiconductor cool.
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 Technical Articles

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