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200-W; 4400 - 5000-MHz; 50-Ohm Input/Output-Matched; GaN HEMT
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Wolfspeed’s CGHV50200F is a gallium-nitride (GaN) high-electron-mobility transistor (HEMT) designed specifically with high efficiency; high gain and wide bandwidth capabilities; which makes the CGHV50200F ideal for troposcatter communications; 4.4 – 5.0-GHz C-Band SatCom applications and beyond line of sight. The transistor is supplied in a ceramic/metal flange package; type 440215.

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Frequency Min
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GaN on SiC
4.4 GHz
5 GHz
200 W
11.5 dB
40 V
Packaged Discrete Transistor
GaN on SiC
4.4 GHz
5 GHz
200 W
11.5 dB
40 V
Evaluation Board
  • 4.4 – 5.0 GHz Operation
  • 180 W Typical PSAT
  • 11.5 dB Typical Power Gain
  • 48% Typical Power Efficiency
  • 50 Ohm Internally Matched
  • Troposcatter Communications
  • Beyond Line of Sight – BLOS
  • Satellite Communications
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Technical Papers & Articles
by Raymond S. Pengelly – William Pribble – Thomas Smith
This Simulation of power amplifiers (PAs) for modern wireless base station and small cell systems is an essential part of the design process. At a cell site – the PA consumes the bulk of the dc power – generates the most heat – and thus represents the greatest operational cost. Maximum PA efficiency is a necessity to manage these costs – which is a sizeable challenge in a PA that also must be highly linear to support the complex multilevel modulation types and wide bandwidths used for current and developing wireless transmission standards. Accurate simulation allows the PA designer to meet these challenges by exploring the available design options and then optimizing the circuit that is selected for the application.
Technical Papers & Articles
by Donald A. Gajewski – Scott Sheppard – Simon Wood – Jeff B. Barner – Jim Milligan – and John Palmour.
This paper discusses the reliability performance of Wolfspeed GaN/AlGaN high electron mobility transistor (HEMT) MMIC released process technologies – fabricated on 100 mm high purity semi-insulating (HPSI) 4H-SiC substrates.
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Knowledge Center

Aerospace & Defense

Thermal Considerations for High-Power GaN RF Amplifiers

Many RF applications require very long lifetimes with typical military and telecom use cases demanding more than 10 years of operation. Junction temperature Tj, or the temperature of the base semiconductor in the device, plays an important role in device reliability as does the substrate material in keeping the base semiconductor cool.
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