May 10 - 12, 2022
Visit Wolfspeed in person at PCIM May 10th – 12th in Nuremberg
PCIM is the world’s largest power electronics conference, where attendees can learn about the latest industry trends and innovations. Wolfspeed is excited to present Scale and Scalability for a rapidly growing Silicon Carbide market. Our Silicon Carbide power products bring high efficiency and high power density to electric vehicles, fast charging stations, enterprise data centers, renewable energy systems and more. Visit us at booth 7-435 to learn more and reach out to our sales team to today.
The Mohawk Valley Fab (MVF) construction is complete, the first 200-mm wafers demonstrated, and the fab is undergoing qualification for mass production. This brand new, state-of-the-art power wafer fabrication facility will be automotive-qualified and 200mm-capable. Visit us at booth 7-435 to learn more. You can also check out our Capacity Expansion Overview.
Industry Workshops & Presentations
Presentation: A SiC Based 30kW Three Phases Interleaved LLC Converter for EV Fast Charger
Speaker: Jianwen Shao
Date: Tuesday, May 10, 2022 at 2:40 PM CET
Room: München 1
Abstract: This paper presents a SiC MOSFET-based 30kW three-phase interleaved LLC resonant converter for Electric Vehicle (EV) fast charger, with high efficiency, high power density and wide output voltage range. A flexible gain control scheme of the three-phase LLC resonant converter is studied. A digital controlled prototype with a switching frequency range of 135kHz-250kHz is demonstrated with 200Vdc-1000Vdc output voltage range, 6.5kW/L power density and exceeding 98% in peak efficiency.
Presentation: Silicon Carbide: New applications within Industrial and Energy – The next Great Frontier
Speaker: Guy Moxey
Date: Tuesday, May 10, 2022 at 3:50 - 4:10 PM CET
Room: Hall 6, Stand 6-246
Presentation: The Next Level of Wide Bandgap Design - SiC
Speaker: Guy Moxey
Date: Wednesday, May 11, 2022 at 1:10 PM CET
Room: Industry Forum Hall 6, Booth 6-246
Presentation: High temperature performance of next generation 1200 V SiC MOSFET die with advanced packaging technology
Speaker: Amy Romero
Date: Thursday, May 12, 2022 at 10:10 AM CET
Room: Brüssel 1
Abstract: The combination of high power capable SiC MOSFETs with advanced packaging can lead to very high-power densities, creating the challenge of having a reliable design that can not only withstand high power stresses but also high temperature conditions. This paper addresses that concern with the first ever integration of a newly developed 1200 V, 14 mΩ, 25 mm2 SiC MOSFET with a sintered die attach and copper top side solution which allows for copper wire bonds. Both die and package level technology qualification results are shown including successful High Temperature Reverse Bias (HTRB), High Temperature Gate Bias (HTGB) and power cycling tests, all up to 200 °C and High Voltage High Humidity, High Temperature Reverse Bias Test (HV-H3TRB). Post-stress physical analysis is also shown.
Presentation: Wolfspeed Power Modules for Today's EV Market
Speaker: Ty McNutt
Date: Tuesday, May 10, 2022 at 2:10 PM CET
Room: Exhibitors Forum
Abstract: Wolfspeed power modules offer on- and off-board solutions for today's EV applications. Scalable in power, Wolfspeed power modules will be reviewed that can offer vehicle platforms a solution that will minimize engineering time across performance levels. Reference designs highlighting the design benefits of these modules will be reviewed, along with key components in the ecosystem surrounding the modules.