DURHAM, NC -- Cree’s silicon-carbide (SiC) technology continues to enable smaller, lighter, more efficient and lower-cost power systems with a new all-SiC 300A, 1.2kV half-bridge module. Packaged in industry-standard 62mm housing, the new module reduces energy loss due to switching by more than five times compared to the equivalent silicon solution. This best-in-class efficiency enables for the first time all-SiC high power converters rated up to the megawatt level, extending Cree’s leadership in SiC chip technology into high current power modules.
“The drop-in feature of Cree’s new all-SiC power module allows us to achieve 99 percent efficiency while reducing the power module count by a factor of 2.5 in our existing HF induction heating systems,” said John K. Langelid, R&D manager, EFD Induction. “These benefits are greatly valued as a reduced cost of ownership by our end customers.”
The new all-SiC 62mm half-bridge module’s game-changing switching efficiency and performance allow designers to reduce the amount of magnetic and cooling elements, delivering double the power density and a lower system cost while also reducing end user cost of ownership. Offering a simplified two-level topology that is feasible at higher frequencies, the new module can also eliminate the need to invest in multi-level silicon-based solutions.
The latest Cree® SiC power module is available with multiple gate driver options and is pin compatible to standard 62mm half-bridge modules, including IGBT modules rated at 450A or more. This allows designers to quickly and easily evaluate the module’s unparalleled capabilities.
“The new 62mm half-bridge power module is yet another example of Cree’s commitment to the commercialization of SiC-based power electronics,” said Cengiz Balkas, general manager and vice president, Cree Power and RF. “Utilizing our success in large-area SiC power devices, we have extended the benefits of SiC power modules to the 100kW to 1MW power range for applications such as induction heating, central solar inverters and active front-end motor drives. These new power modules are introduced at a breakthrough price-performance point that unlocks immediate cost savings in these applications.”
The new all-SiC 300A, 1.2kV half-bridge module will be available as part number CAS300M12BM2 at preferred distributors like Mouser, Digi-Key and Arrow’s RF & Power Business, and will be priced at $451 each for 1,000-unit quantities. Companion gate drivers are also available from Cree and Prodrive. Visit www.cree.com/power/CAS300M12BM2 for more information and access to data sheets, material content and application notes.
Cree is a market-leading innovator of semiconductor products for power and radio-frequency (RF) applications, lighting-class LEDs and LED lighting solutions. Cree's product families include LED fixtures and bulbs, blue and green LED chips, high-brightness LEDs, lighting-class power LEDs, power-switching devices and RF devices. Cree products are driving improvements in applications such as general illumination, electronic signs and signals, power supplies and solar inverters.
Please refer to www.cree.com for additional product and company information.
This press release contains forward-looking statements involving risks and uncertainties, both known and unknown, that may cause actual results to differ materially from those indicated. Actual results may differ materially due to a number of factors, including the risk that actual savings will vary from expectations; the risk we may be unable to manufacture these new products with sufficiently low cost to offer them at competitive prices or with acceptable margins; the risk we may encounter delays or other difficulties in ramping up production of our new products; customer acceptance of our new products; the rapid development of new technology and competing products that may impair demand or render Cree’s products obsolete; and other factors discussed in Cree’s filings with the Securities and Exchange Commission, including its report on Form 10-K for the year ended June 30, 2013, and subsequent filings.