Features
- Low Forward Voltage (VF) Drop with Positive Temperature Coefficient
- Zero Reverse Recovery Current / Forward Recovery Voltage
- Temperature-Independent Switching Behavior
- Low Profile Package with Low Inductance
C6D10170H
C6D10170H
1700 V, 10 A, TO-247-2 package, Gen 6 Discrete SiC Schottky Diode
Wolfspeed’s 1700 V Discrete Silicon Carbide (SiC) Schottky Diodes meet higher efficiency standards than standard silicon based solutions, while reaching higher frequencies and power densities. Silicon Carbide Schottky diodes can be easily paralleled to meet various application demands, without concern of thermal runaway. In combination with the reduced cooling requirements and improved thermal performance of Silicon Carbide products, these diodes are able to provide lower overall system costs in a variety of diverse applications.
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1700 V Discrete Silicon Carbide Schottky Diodes
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Product Details
Benefits
- Enables High Switching Frequency Operation
- Increased Power Density
- Parallel Mode Operation Possible
- Reduces System Size, Weight, Cooling Requirements
Applications
- Industrial Switched Mode Power Supplies
- Uninterruptible & AUX Power Supplies
- Boost for PFC & DC-DC Stages
- EV Chargers
- Pulse Power
Documents, Tools & Support
- Technical & Sales Documents
- Tools & Support
- Compliance
Documents
Document Type | Document Name | Last Updated |
|---|---|---|
| Application Notes | 09/2022 | |
| Application Notes | 02/2022 | |
| Application Notes | 09/2015 | |
| Application Notes | 05/2023 | |
| Data Sheets | 12/2022 | |
| Product Catalog | 02/2024 | |
| Sales Terms | 12/2021 | |
| Sales Terms | This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
| 02/2024 |
Knowledge Center
Low Load Efficiency Simulations with Silicon Carbide
Power electronics devices are almost never working at maximum of their capabilities because of safety, reliability but even application mission profile. Our experts will demonstrate how Wolfspeed's free SpeedFit simulation tool is the perfect starting point before moving to accurate LTSpice simulations.
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Wolfspeed WolfPACK™ Power Module Press-In Process
In this video, we’ll walk you through the press-in and press-out process for Wolfspeed WolfPACK™ silicon carbide power modules, which are available with and without pre-applied thermal interface material (TIM).
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Design Next-Generation Data Center Cooling Systems with Silicon Carbide
Data center cooling systems account for 20-45% of power consumed by data centers. The efficiency of these cooling systems can be improved with silicon carbide leading to up to 50% reduction in system losses.
Continue Reading Technical Articles