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RF Hardware Design Files

RF Hardware Design Files

Application Circuit Designs
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Wolfspeed offers time-saving Hardware Reference Designs for some of the most in-demand Gallium Nitride on Silicon Carbide devices in RF systems. The custom Reference Design files below include the Assembly Drawing; BOM; Schematic; and PCB Notes. These files will help allow designers to create rugged and reliable systems with best-in-class power density; performance and efficiency.

Wolfspeed’s Application Engineering team also has a library of additional software reference designs that are implementations of our proprietary LS model; for specific applications; where the design is not built into hardware. These are great “starter designs” to give RF Power Amplifier designers a quick; accurate first look at a device’s potential for that application. Click here to request access to the RF portal and the free library of design tools.

Product SKU
Design Files
Technology
Frequency Min
Frequency Max
Peak Output Power
Gain
Efficiency
Operating Voltage
CMPA0527005F-AMP1-REF
GaN on SiC
0.5 GHz
2.7 GHz
8 W
15 dB
50%
50 V
CG2H30070F-AMP2-REF
GaN on SiC
0.5 GHz
3 GHz
48%
28 V
CG2H40035F-AMP1-REF
GaN on SiC
0.5 GHz
3 GHz
30 W
11 dB
50%
28 V
CGHV27060MP-AMP3-REF
GaN on SiC
0.8 GHz
2.7 GHz
60 W
12 dB
55%
50 V
CGHV27060MP-AMP4-REF
GaN on SiC
DC
1 GHz
60 W
13.5 dB
60%
50 V
CMPA0530002S-AMP1-REF
GaN on SiC
0.5 GHz
3 GHz
45%
28 V
CMPA2060035F-AMP2-REF
GaN on SiC
2 GHz
6 GHz
50 W
18 dB
37%
32 V
CG2H40010F-AMP1-REF
GaN on SiC
0.5 GHz
55%
28 V
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RF
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Aerospace & Defense

Thermal Considerations for High-Power GaN RF Amplifiers

Many RF applications require very long lifetimes with typical military and telecom use cases demanding more than 10 years of operation. Junction temperature Tj, or the temperature of the base semiconductor in the device, plays an important role in device reliability as does the substrate material in keeping the base semiconductor cool.
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