CG2H80015D, CG2H80030D, CG2H80060D, CG2H80120D, CGH60008D, CGH60015D, CGH60030D, CGH60060D, CGH60120D, CGH80030D, CGHV1J006D, CGHV1J025D, CGHV1J070D, CGHV27320T1AD, CGHV30500D3, CGHV40320D, CGHV40320D5, CGHV40320T1AD, CGHV60015T1D, CGHV60018D5, CGHV60030D5, CGHV60030T1D, CGHV60035D5, CGHV60040D, CGHV60060D5, CGHV60075D, CGHV60075D5, CGHV60080D5, CGHV60080T1AD, CGHV60100D, CGHV60120D5, CGHV60120T1AD, CGHV60120T1D, CGHV60125T1AD, CGHV60160D5, CGHV60160T1AD, CGHV60170D, CGHV60180D5, CGHV60240D5, CGHV60240T1AD, CGHV60240T1D, CGHV60250D5

by Raymond S. Pengelly, William Pribble, Thomas Smith

This Simulation of power amplifiers (PAs) for modern wireless base station and small cell systems is an essential part of the design process. At a cell site, the PA consumes the bulk of the dc power, generates the most heat, and thus represents the greatest operational cost. Maximum PA efficiency is a necessity to manage these costs, which is a sizeable challenge in a PA that also must be highly linear to support the complex multilevel modulation types and wide bandwidths used for current and developing wireless transmission standards. Accurate simulation allows the PA designer to meet these challenges by exploring the available design options and then optimizing the circuit that is selected for the application.

by Donald A. Gajewski, Scott Sheppard, Simon Wood, Jeff B. Barner, Jim Milligan, and John Palmour.

This paper discusses the reliability performance of Wolfspeed GaN/AlGaN high electron mobility transistor (HEMT) MMIC released process technologies, fabricated on 100 mm high purity semi-insulating (HPSI) 4H-SiC substrates.