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62 mm BM3 Silicon Carbide Half-Bridge Power Modules

Angled product photo of the 62mm BM3 half-bridge power module for Wolfspeed.
WAS310M17BM3
1700 V, 4.29 mΩ, 62mm, Half-Bridge SiC Power Module
Wolfspeed’s BM3 power module platform provides the system benefits of Silicon Carbide (SiC) while maintaining the robust, industry-standard 62 mm module package. The internal design of Wolfspeed’s 62 mm BM3 package enables high speed Silicon Carbide switching benefits and increased system efficiency, due to the low-inductance layout. The BM3 platform is a perfect fit for high frequency industrial applications such as induction heating, rail and traction, motor drives, and EV charging infrastructures.

Products

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62 mm BM3 Silicon Carbide Half-Bridge Power Modules

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62 mm BM3 Silicon Carbide Half-Bridge Power Modules

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Data Sheet
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Configuration
Blocking Voltage
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RDS(ON) at 25°C
Generation
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Recommended For New Design?
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WAS310M17BM3
62mm
Half-Bridge
1700 V
310 A
4.29 mΩ
Gen 3 MOS + Diodes
150 °C
105 x 62 x 31 mm
Yes
Industrial + HV-H3TRB

Product Details

Features
  • Industry-Leading; Reliable Silicon Carbide MOSFET Technology in Robust; Well-Established 62mm Form Factor
  • Strong Thermal Performance + Material Selections Optimized for Industrial & Harsh Environment Applications
  • Low-Inductance Design (10 – 15 nH) for Fast Switching with Low Power Losses
  • MOSFET Die and Selected Modules Qualified to HV-H3TRB
Benefits
  • Broad Portfolio of Current and Voltage Ratings Available to Fit Diverse Industrial Application Requirements
  • Fast Time to Market with Minimal Development Required for Transition from 62 mm IGBT Packages
  • Reduced Cooling Requirements & Overall System Cost
  • Optimized Internal Layout for Low Power Losses & Minimal Overshoot for Maximum Voltage Utilization
Applications
  • Induction Heating
  • Motor Drives
  • Energy Generation / Smart Grids / Smart Energy
  • Railway
  • EV Fast Charging
  • UPS and SMPS

Documents, Tools & Support

Display All SKUs in Product Family (11)

Documents

Document Type
Document Name
Last Updated
Application Notes
09/2022
Application Notes
11/2021
Application Notes
08/2023
Application Notes
01/2023
Application Notes
03/2024
Application Notes
11/2023
Application Notes
01/2024
User Guide
12/2023
User Guide
01/2024
User Guide
01/2024
Data Sheets
01/2024
Product Catalog
02/2024
Sales Sheets & Flyers
01/2024
Sales Sheets & Flyers
01/2024
Sales Sheets & Flyers
02/2023
Sales Terms
This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
02/2024
Sales Terms
12/2021
Technical SupportPower Applications Forum

Knowledge Center

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