Skip to Main Content
Contact
浏览产品 (中文)
Corporate, Investors

Cree, Inc. to Participate in Upcoming Investor Conferences

Jun 02, 2021
  • Share on Facebook
  • Share on Twitter
  • Share on LinkedIn
  • Share in an email

DURHAM, N.C. – Cree, Inc. (Nasdaq: CREE), today announced that its senior management will present at the following virtual investor conferences:

  • Neill Reynolds, Chief Financial Officer, will present at the Evercore ISI Inaugural TMT Conference on June 7, 2021 at 3:30PM ET.
  • Gregg Lowe, Chief Executive Officer, and Neill Reynolds, Chief Financial Officer, will present at the Bank of America Global Technology Conference on June 8, 2021 at 11:30AM ET.
  • Gregg Lowe, Chief Executive Officer, and Neill Reynolds, Chief Financial Officer, will present at the Citi Silicon Valley Virtual IT Hardware Bus Tour on June 11, 2021 at 10:00AM ET.

A live webcast of the presentations will be available on the Investor section of Cree’s website. To access the webcasts, please visit http://investor.cree.com/events.cfm.

+++

About Cree, Inc.

Cree is an innovator of Wolfspeed® power and radio frequency (RF) semiconductors. Cree’s Wolfspeed product families include silicon carbide materials, power-switching devices and RF devices targeted for applications such as electric vehicles, fast charging inverters, power supplies, telecom and military and aerospace.

For additional product and Company information, please refer to www.cree.com.

Contact:
Tyler Gronbach
Cree, Inc.
Vice President, Investor Relations
Phone: 919-407-4820
investorrelations@cree.com

Source: Cree, Inc.

Need information?
Contact Us
Stay Informed
Need information?
Stay Informed

More Articles

Aug 19, 2022
WRAL Tech Wire

Wolfspeed could build new $1B+ semiconductor facility in NC, CEO says

Read More

Footer

Wolfspeed Logo

Social Media

  • Facebook
  • Twitter
  • LinkedIn
  • YouTube
Copyright © 2022 Wolfspeed, Inc.