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SiC Materials

Materials Products

Industry-Leading Portfolio, Innovation and Scale

With more than 30 years of SiC development and manufacturing experience, Wolfspeed produces the industry’s broadest range of SiC materials. Offering n-type conductive SiC products and a variety of SiC epitaxy options, Wolfspeed delivers the quality and quantity necessary to support the rapidly expanding demand for high-efficiency, SiC power semiconductors.

When you partner with Wolfspeed, you get the best and most innovative materials.


Products

N-Type
SiC Substrates
HPSI
Semi-insulating SiC Substrates
SiC Epitaxy
N-Type & P-type Epitaxial Layers
Nitride Epitaxy
GaN, AlInN, InGaN Epitaxial Layers

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Physical Properties

Polytype
Single-Crystal 4H
Supported diameters
150mm
Crystal structure
Hexagonal
Bandgap
3.26 eV
Thermal conductivity (n-type; 0.020 Ω*cm)
a~4.2 W/cm • K @ 298 K
c~3.7 W/cm • K @ 298 K
Thermal conductivity (HPSI)
a~4.9 W/cm • K @ 298 K
c~3.9 W/cm • K @ 298 K
Lattice parameters
a=3.073 Å
c=10.053 Å
Mohs hardness
9

Dimensional Properties, Terminology, & Methods

Diameter
The linear dimension across the surface of the wafer. Measurement is performed using an automated micrometer, traceable to the ANSI standard, providing the average value for each individual wafer.
Thickness, Center Point
Measured with ANSI-certified non-contact tools at the center of each individual wafer.
Surface Orientation
Denotes the orientation of the surface of a wafer with respect to a crystallographic plane within the lattice structure. In wafers cut intentionally “off orientation,” the direction of cut is parallel to the primary flat, away from the secondary flat. Measured with x-ray goniometer on a sample of one wafer per boule in the center of the wafer.
Orthogonal Misorientation
In wafers intentionally cut “off orientation,” the angle between the projection of the surface normal onto a (0001) plane and the nearest [1120] direction.

Materials Tools & Support

Materials Catalog

Knowledge Center

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Power Modules

Power modules: One shortcut to EMI compliance 

The design and geometry of power modules enable EMI modeling which empowers designers to predict and understand their system’s EMI behavior early in the design process. 
Continue Reading  Technical Articles

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