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    • SiC for Power Electronics
    SiC Materials

    Silicon Carbide for Power Electronics

    • Conductive SiC Substrate
    • SiC Epitaxy
    • Conductive SiC Substrate
    • SiC Epitaxy

    Keeping Pace with the World's Demand for SiC Power

    Industry-Leading Flexibility and Scale
    With more than 30 years of silicon carbide (SiC) development and manufacturing experience, Wolfspeed produces the industry’s broadest range of SiC materials. Offering n-type conductive SiC products and a variety of SiC epitaxy options, Wolfspeed delivers the quality and quantity necessary to support the rapidly expanding demand for high-efficiency, SiC power semiconductors.

    When you partner with Wolfspeed, you get the best and most innovative materials.

    Support

    Conductive SiC Substrate and Epitaxy One Pager (PDF, 285 KB)Download
    Materials Catalog (PDF, 733 KB)Download

    How to Order

    Let us guide you through the steps to choose the right part number.

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    Infographic diagram of how to order Wolfspeed's materials parts.

    Materials Portfolio

    Polytype

    • 4H

    Surface Orientation

    • 4° Off-axis

    Supported Diameters

    • 150 mm
    • 200 mm

    SiC Epitaxy

    • n-type
    • p-type
    • Thick epitaxy

    Conductive SiC Substrate Product Descriptions

    The Materials Business Unit produces a wide assortment of n-type conductive SiC products. Wolfspeed's industry-leading, high-volume platform process provides our customers with the highest degree of material quality, supply assurance and economies of scale.

    Part Number
    Description
    W4NRG4C-C1-U200
    4H-SiC, n-type, Research Grade, 150mm, 4° Off-Axis, 0.015-0.028 Ω-cm, Ultra Low MPD ≤1/cm2, 350um Thick w/ 47.5mm Flat, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate
    W4NPG4C-C1-U200
    4H-SiC, n-type, Production Grade, 150mm, 4° Off-Axis, 0.015-0.028 Ω-cm, Ultra Low MPD ≤1/cm2, 350um Thick w/ 47.5mm Flat, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate
    W4NPG4C-C1-B200
    4H-SiC, n-type, Production Grade, 150mm, 4° Off-Axis, 0.015-0.028 Ω-cm, Ultra Low MPD ≤1/cm2, Low BPD ≤1500/cm2, 350um Thick w/ 47.5mm Flat, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate
    W4NPH4A-N1-0200
    4H-SiC, n-type, Production Grade, 200mm, 4° off-axis, 0.015-0.025 Ω-cm, 350μm Thick w/ Notch, Double-Sided Polish Silicon Face CMP Epi Ready, Bare Substrate

    Dimensional Properties, Terminology and Measurements

    Flat Length
    Linear dimension of the flat measured with automated optical micrometer.​
    Primary Flat
    The flat of the longest length on the wafer, oriented such that the chord is parallel with a specified low-index crystal plane.
    Primary Flat Orientation
    The primary flat is the (1100) plane with the flat face parallel to the [1120] direction.
    Notch
    The notch position is parallel to the [1120] direction, with the notch bisector in the (1100) plane.
    Marking
    For silicon face polished material, the carbon face of each individual wafer is laser-marked with OCR-compatible font, similar to definitions and characteristics in SEMI M12. The laser markings are positioned upright when the major flat or notch is oriented up, making the scribe easier to read when the wafers are loaded into cassettes. This format includes a wafer supplier identification code, validating the wafer’s authenticity. It also includes a checksum, which is an error-detection method that prevents OCR mis-read errors and reduces the instance of processing errors associated with such events.

    SiC Epitaxy Product Descriptions

    Wolfspeed produces n-type and p-type SiC epitaxial layers on SiC substrates, and has the widest range of available layer thickness up to 200 μm. Unless noted otherwise on the product quotation, the epitaxial layer structure will meet or exceed the following specifications. Additional comments, terms and conditions may be found in the specification document.

    Substrate Orientation: SiC Epitaxy is available only for off-axis substrates

    150 mm Product Description

    Conductivity
    n-type
    p-type
    Dopant
    Nitrogen
    Aluminum
    ‎  Net doping density
    ND-NA
    NA-ND
      Silicon face
    5E14 – 1E19/cm3
    5E14 – 1E20/cm3
      Tolerance
    ±20%
    ±50%
    Thickness range
    0.2 - 200 microns
    0.2 - 200 microns
      Tolerance
    ±8%
    ±10%

    200 mm Product Description

    Conductivity
    n-type
    p-type
    Dopant
    Nitrogen
    Aluminum
    ‎  Net doping density
    ND-NA
    NA-ND
      Silicon face
    5E14 – 1E19/cm3
    5E14 – 1E20/cm3
      Tolerance
    ±20%
    ±50%
    Thickness range
    0.2 - 200 microns
    0.2 - 200 microns
      Tolerance
    ±8%
    ±10%

    Contact Wolfspeed Materials Sales for specification on multi-layer or custom epitaxy requests

    SiC Epitaxy Product Specifications

    Characteristics
    Maximum Acceptability Limits
    Test Methods
    Defect Definitions
    Methodology
    Scratches
    Cumulative scratch length ≤ wafer diameter
    Diffuse
    Illumination
    D1
    M1,M2
    Backside cleanliness
    95% clean
    Diffuse
    Illumination
    D2
    M1,M2
    Edge chips
    See Substrate Specifications
    Diffuse
    Illumination
    D3
    M2
    Epi defects*
    Customized Defect Classes available
    Lasertec SICA
    D4-D5
    M3
    Net doping
    See Product Description table
    CV
    -
    M4
    Thickness
    See Product Description table
    FTIR
    -
    M5

    *Note: 3mm edge exclusion

    Tools & Support

    Conductive Silicon Carbide Substrates and Epitaxy (PDF, 285 KB)
    Materials Catalog (PDF, 733 KB)
    Materials Document Library
    Contact the Materials Team

    Knowledge Center

    View All

    PowerMakers:
    How Wolfspeed’s Fayetteville Team Turns Silicon Carbide Expertise into Customer Momentum

    At our Fayetteville site, Ty McNutt and his team don’t just solve for specs —they rethink systems. That’s the difference between supplying parts and becoming the partner customers rely on.
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    Continue Reading  Technical Articles

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