With industry-leading low specific on-resistance over temperature, Wolfspeed’s broad portfolio of Bare Die MOSFETs enables a system-level customization and efficiency to maximize power density. Wolfspeed offers one of the broadest Silicon Carbide (SiC) power die product portfolios in the industry in terms of die layout and metallurgy for optimized module assembly. We continue to lead in Silicon Carbide with Wolfspeed's first automotive qualified Gen 3 family of Bare Die Silicon Carbide (SiC) MOSFETs providing the highest figures of merit in the most demanding applications. As a vertically integrated Silicon Carbide leader for the past 30 years, Wolfspeed provides advanced design, extensive qualification, screening and parametric characterization resulting in the most reliable and robust devices on the market.
Wolfspeed WolfPACK™ new Silicon Carbide power modules are designed to provide system scalability and flexibility, providing customers with end-to-end coverage for their system designs. This infographic will show how Silicon Carbide technology help simplify designs with optimized performance and increased speed to market.
Wolfspeed is pleased to introduce the newest member in the WolfPACK family, the GM3 power module. As the bigger brother to the FM3 package, the addition of the GM3 to Wolfspeed's all SiC baseplateless power module portfolio enables scalable designs based on a flexible core set of building blocks. This webinar will discuss the benefits of this new package and its configurations, along with the tools Wolfspeed provides to ensure quick adoption. Learn how easy it is to scale-up your existing design and what advantages the GM3 package can provide to achieve your design goals.
This article features Wolfspeed’s new WolfPACK power module family, the culmination of decades of investment in Silicon Carbide research and development, coupled with a baseplate-less design to give OEMs and design engineers the most choice to support use cases across a broad array of industry segments.