Welcome to SpeedFit 2.0, the industry’s most comprehensive system-level circuit simulator for silicon carbide power applications.
Accelerate the design process with simulation results you can trust. SpeedFit 2.0 quickly calculates losses and estimates junction temperature for power devices based on lab data for common topologies ranging from simple buck and boost converters to a fully bi-directional totem pole PFC with resonant DC/DC converter. Using SpeedFit 2.0, you can quickly determine:
The right product for an application
Comparative performance for different devices
How the performance with varies Rg
How many devices need to be paralleled
Returning users, please perform a hard refresh on your browser (press Ctrl+F5 in most browsers) to ensure you are working with the latest version of the SpeedFit Simulator.
SpeedFit 2.0 is an efficient simulation tool that optimizes the design process by allowing users to quickly compare different system specifications, topologies, devices and thermal parameters.
Wolfspeed’s SpeedFit is a powerful online simulator that allows designers to quickly evaluate different power conversion topologies and Silicon Carbide (SiC) devices. The platform is best utilized early in a design cycle to analyze design tradeoffs between different topologies, estimate semiconductor losses and junction temperatures, as well as identifying the best Silicon Carbide (SiC) MOSFETs and Silicon Carbide (SiC) diodes to use in a given design. This saves a great deal of time by reducing the need to sort through datasheets and calculate device losses to select an optimized device. The SpeedFit tool supports numerous power conversion topologies for DC-DC, AC-DC, and DC-AC to support a wide range of applications. This whitepaper will explore some of the topologies including newly added options and demonstrate how SpeedFit can be used to evaluate different device packages and paralleling options.
Wolfspeed’s SpeedFit is a powerful online simulator that allows designers to quickly evaluate different power conversion topologies and Silicon Carbide (SiC) devices. The platform is best utilized early in a design cycle to analyze design tradeoffs between different topologies, estimate semiconductor losses and junction temperatures, as well as identifying the best Silicon Carbide (SiC) MOSFETs and Silicon Carbide (SiC) diodes to use in a given design. This saves a great deal of time by reducing the need to sort through datasheets and calculate device losses to select an optimized device. The SpeedFit tool supports numerous power conversion topologies for DC-DC, AC-DC, and DC-AC to support a wide range of applications. This whitepaper will explore some of the topologies including newly added options and demonstrate how SpeedFit can be used to evaluate different device packages and paralleling options.
Adam Anders of Wolfspeed covers how to model with the SpeedFit Design Simulator™, a powerful online simulator that allows designers to quickly evaluate different power conversion topologies and Silicon Carbide (SiC) devices. The platform is best utilized early in a design cycle to analyze design tradeoffs between different topologies, estimate semiconductor losses and junction temperatures, as well as identifying the best SiC MOSFETs and SiC diodes to use in a given design.
Wolfspeed’s SpeedFit 2.0 Design Simulator helps you select the right Wolfspeed SiC product for your design as well as run simulations to help you easily predict and minimize conduction and switching losses, quickly compare different device and thermal configurations, and generate circuit diagrams and a summary report to help you bring the whole thing together.
Understanding the in-circuit behavior of Silicon Carbide (SiC) MOSFETs and Schottky diodes in power supplies is a critical component in the design process. Visualizing the performance of these SiC components can help a designer more readily leverage this technology.
