Wolfspeed has transitioned to a new wafer scribe format based upon SEMI specification M12-0523. This conversion has been completed on 150mm diameter wafer products. The M12-based scribe is positioned upright when the major flat or notch is oriented up, making the scribe easier to read when the wafers are loaded into cassettes. The new format includes a wafer supplier identification code, validating the wafer’s authenticity. It also includes a checksum, which is an error-detection method that prevents OCR mis-read errors and reduces the instance of processing errors associated with such events. 100mm products will remain Wolfspeed’s legacy scribe.
With more than 30 years of development and manufacturing experience, Wolfspeed is driving innovation with the industry’s broadest range of SiC and GaN materials. Delivering semi-insulating substrates and nitride epitaxy options up to the newly available diameter of 150mm, Wolfspeed materials enable performance far exceeding that of any other technology, for telecom, aerospace, or defense applications with world-leading bandwidth, efficiency and frequency of operation.
When you partner with Wolfspeed, you get the best and most innovative materials.
Part Number | Description |
|---|---|
W4TRF0R-0200 | 4H-SiC, HPSI, Research Grade, 100mm, On-Axis, ≥1E6 Ω-cm, Standard MPD, 500µm Thick w/ 32.5mm Flat, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate |
W4TPF0R-0200 | 4H-SiC, HPSI, Production Grade, 100mm, On-Axis, ≥1E6 Ω-cm, Standard MPD, 500µm Thick w/ 32.5mm Flat, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate |
W4TRG0R-N-0200 | 4H-SiC, HPSI, Research Grade, 150mm, On-Axis, ≥1E6 Ω-cm, Standard MPD, 500µm Thick w/ Notch, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate |
W4TPG0R-N-0200 | 4H-SiC, HPSI, Production Grade, 150mm, On-Axis, ≥1E6 Ω-cm, Standard MPD, 500µm Thick w/ Notch, Double-Sided Polish Si Face CMP Epi Ready, Bare Substrate |
Wolfspeed’s High Purity Semi-Insulating wafers are not vanadium-doped
Flat Length | Linear dimension of the flat measured with automated optical micrometer. |
Primary Flat | The flat of the longest length on the wafer, oriented such that the chord is parallel with a specified low-index crystal plane. Not applicable to 150mm wafers. |
Primary Flat Orientation | The primary flat is the (1100) plane with the flat face parallel to the [1120] direction. |
Secondary Flat | A flat of shorter length than the primary flat, whose position with respect to the primary flat identifies the face of the wafer. Not applicable to 150mm wafers. |
Secondary Flat Orientation | The secondary flat is 90˚ clockwise from the primary flat, +/-5˚, referencing the silicon face up. |
100 mm HPSI Marking | HPSI products are silicon face polished, and the carbon face of each individual wafer is laser-marked with OCR-compatible font, similar to definitions and characteristics in T5 specifications. For 100mm wafers, the laser marking are centered when the primary flat is oriented down. |
150 mm HPSI Marking | All 150 mm HPSI products have a notch with 1.0 mm (+0.25,-0.00) depth. A line drawn from the wafer center to the notch is parallel to the [1-100] ±5.0 deg direction. The laser markings are offset right when looking at the carbon face with the notch oriented down. |
