应用
- 电动汽车辅助电机
- 暖通空调 (HVAC)
- 工业电机驱动
本参考设计展示了如何使用碳化硅 (SiC) MOSFET来优化电动汽车辅助电机、暖通空调 (HVAC) 及其他类似应用中的电机驱动性能。该设计采用顶部散热 (TSC) U2封装,显著提高了系统级功率密度和效率,同时改善了热管理并增加了电路板布局的灵活性。碳化硅更高的导热性和在更高开关频率下更低的损耗,使得系统尺寸和冷却要求得以减小,压缩机运行更快,噪声、振动与声振粗糙度 (NVH) 更低。
本设计实现:
规格:
1200 V, 75 mΩ, TO-263-7 XL package, Automotive qualified, Discrete SiC MOSFET
1200 V, 75 mΩ, TO-263-7 XL package, Automotive qualified, Discrete SiC MOSFET
1200 V, 75 mΩ, TO-263-7 XL package, Automotive qualified, Discrete SiC MOSFET
1200 V, 75 mΩ, TO-263-7 XL package, Automotive qualified, Discrete SiC MOSFET
1200 V, 75 mΩ, TO-263-7 XL package, Automotive qualified, Discrete SiC MOSFET
1200 V, 75 mΩ, TO-263-7 XL package, Automotive qualified, Discrete SiC MOSFET
5A, High Voltage, Isolated Gate Driver with Internal Miller Clamp for Low-Side MOSFETs
10A, High Voltage, Isolated Gate Driver With Short-Circuit Protection for High-Side MOSFETs
32-bit MCU with 100-MHz, FPU, TMU, 256-kb Flash, CLA, InstaSPIN-FOC, CLB, PGAs, SDFM