Features
- AQG 324 Qualified
- Very low On-State Resistance
- Baseplateless Module with High Performance Si3N4 Insulator
- Laser Weldable Power Terminals
- Sinterable and Solderable Backside (Silver Plated)
- Solderable Signal Pins (Silver Plated)
- Package with Extended Creepage (Creepage Distance > 6.3 mm)
- Comparative Tracking Index (CTI) > 600 (Material Group I)
- Limited Extended Operation (TVJ(op) = 200 °C for 100 h)
- Available in two Signal Pin Length (18.5 mmm and 19 mm) Variants
