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Wolfspeed WolfPACK™ Silicon Carbide Power Modules Family

CAB006M12GM3
1200 V; 6 mΩ; GM3; Half-Bridge Silicon Carbide (SiC) Power Module

Wolfspeed’s CAB006M12GM3 is a baseplate-less power module in a half-bridge configuration that meets the requirements of medium power applications; providing solutions across the power electronics continuum. Wolfspeed WolfPACK™ modules are a great choice for designers who want to increase efficiency and power density in a compact; industry standard footprint. The family of modules provide an excellent solution for fast design implementation; scalability; and lower assembly overhead.

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Wolfspeed WolfPACK™ Silicon Carbide Power Modules Family

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Wolfspeed WolfPACK™ Silicon Carbide Power Modules Family

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Recommended For New Design?
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CAB006M12GM3
GM3
Half-Bridge
1200 V
200 A
6 mΩ
Gen 3 MOS
150 °C
62.8 mm x 56.7 mm
Yes
Industrial

Product Details

Features
  • Leading Silicon Carbide MOSFET technology in an industry standard form factor
  • Highest current rated topologies versus market equivalents
  • Built in NTC
  • Press fit connections
Benefits
  • Ease of layout and assembly
  • System scalability and reliability
  • Discrete design consolidated into a single package
  • Increased power density / reduced system size
Applications
  • EV Fast Charging
  • Industrial Power
  • UPS
  • Induction Heating Welding
  • Industrial Motor Drives
  • Power Supplies
  • Solar & Renewable Energy
  • Grid Infrastructure
  • DC/DC Converter

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Documents

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This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
Sales Terms
Technical Support
Power Applications Forum
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Understanding Wolfspeed’s WolfPACK™ Power Module Family: Your Questions Answered!

Wolfspeed WolfPACK™ modules are a great choice for designers who want to increase efficiency and power density in a compact, industry-standard footprint. The family of modules provides an excellent solution for fast design implementation, scalability, long-term design support, and lower assembly overhead.
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