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Wolfspeed WolfPACK™ Silicon Carbide Power Modules Family

CBB032M12FM3T
1200 V; 32 mΩ; FM3; Full-Bridge Silicon Carbide (SiC) Power Module with Pre-Applied Thermal Interface Material

Wolfspeed’s CBB032M12FM3T is a baseplate-less power module in a full-bridge configuration with Pre-Applied Thermal Interface Material that meets the requirements of medium power applications; providing solutions across the power electronics continuum. Wolfspeed WolfPACK™ modules are a great choice for designers who want to increase efficiency and power density in a compact; industry standard footprint. The family of modules provide an excellent solution for fast design implementation; scalability; and lower assembly overhead.

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Wolfspeed WolfPACK™ Silicon Carbide Power Modules Family

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Wolfspeed WolfPACK™ Silicon Carbide Power Modules Family

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CBB032M12FM3T
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FM3
Full-Bridge
1200 V
37 A
32 mΩ
Gen 3 MOS
150 °C
62.8 mm x 33.8 mm
Yes
Industrial

Product Details

Features
  • Leading Silicon Carbide MOSFET technology in an industry standard form factor
  • Highest current rated topologies versus market equivalents
  • Built in NTC
  • Press fit connections
Benefits
  • Ease of layout and assembly
  • System scalability and reliability
  • Discrete design consolidated into a single package
  • Increased power density / reduced system size
Applications
  • EV Fast Charging
  • Industrial Power
  • UPS
  • Induction Heating Welding
  • Industrial Motor Drives
  • Power Supplies
  • Solar & Renewable Energy
  • Grid Infrastructure
  • DC/DC Converter

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This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
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Understanding Wolfspeed’s WolfPACK™ Power Module Family: Your Questions Answered!

Wolfspeed WolfPACK™ modules are a great choice for designers who want to increase efficiency and power density in a compact, industry-standard footprint. The family of modules provides an excellent solution for fast design implementation, scalability, long-term design support, and lower assembly overhead.
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