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HM Power Module Family

1700 V; HM High Performance 62 mm; Half-Bridge Rectifier Silicon Carbide (SiC) Power Module

Wolfspeed has developed the HM power module platform to provide the benefits of Silicon Carbide in power density sensitive applications; while maintaining the baseplate compatibility of a 62mm module. The HM platform’s Silicon Carbide optimized packaging enables 175°C continuous junction operation; with a high-reliability Silicon Nitride (Si3N4) power substrate to ensure mechanical robustness under extreme conditions and a lightweight AlSiC baseplate. The HM3 is a perfect fit for demanding applications such as medical power supplies; aerospace; and traction drives.


HM Power Module Family

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HM Power Module Family

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HM High Performance 62 mm
Half-Bridge Rectifier
1700 V
600 A
Gen 6
175 °C
110 mm x 65 mm x 12.2 mm

Product Details

  • High Performance 62mm Footprint
  • Low Inductance (4.9 nH) Design to Enable High Speed Switching & High Efficiency with Reduced Losses
  • High Junction Temperature (175 °C) Operation
  • Configurations Available with both Second & Third Generation SiC MOSFETs
  • Lightweight AlSiC Baseplate
  • Silicon Nitride Insulator for Robust Thermal Cycling Capability
  • Lightweight; Compact Form Factor with 62mm Compatible Baseplate Enables System Retrofit
  • Increased System Efficiency; due to Low Switching & Conduction Losses of Silicon Carbide
  • High-Reliability Material Selection enabling High-Temperature Operation
  • Railway & Traction
  • Solar & Renewable Energy
  • EV Chargers
  • Industrial Automation & Testing
  • Medical Power Supplies
  • Motor Drives

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This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
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Understanding Wolfspeed’s WolfPACK™ Power Module Family: Your Questions Answered!

Wolfspeed WolfPACK™ modules are a great choice for designers who want to increase efficiency and power density in a compact, industry-standard footprint. The family of modules provides an excellent solution for fast design implementation, scalability, long-term design support, and lower assembly overhead.
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