Features
- Automotive Qualified (AEC-Q101) and PPAP capable
- Top side cooling (TSC) for improved thermal performance
- Surface mount package for automated assembly
- Kelvin source pin for fast gate control
E3M0160120U2
1200 V, 160 mΩ, TSC (U2) package, Automotive qualified, Discrete Silicon Carbide (SiC) MOSFET
Note Coming Soon.
Parametric Data
E-Series Automotive-Qualified Silicon Carbide MOSFETs
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E-Series Automotive-Qualified Silicon Carbide MOSFETs
Product SKU | Data Sheet | Status | Blocking Voltage | RDS(ON) at 25°C | Current Rating | Tjmax | Package | Qualification | Technology |
|---|---|---|---|---|---|---|---|---|---|
E3M0160120U2 Coming Soon | Coming Soon | 1200 V | 160 mΩ | 18 A | 175 °C | TSC (U2) | Automotive | E3M |
End of Section
Ordering & Compliance
E3M0160120U2 Ordering
| Part Number | E3M0160120U2 Coming Soon |
|---|---|
| Order Status | Coming Soon |
| Package | TSC (U2) |
E3M0160120U2 Compliance
| California Prop 65 | Learn More |
|---|---|
| ECCN | EAR99 |
| Moisture Sensitivity Level | MSL 1 |
Related Documents
E3M0160120U2 Related Documents
| Soldering & Handling | |
|---|---|
| Packing & Shipping |
Product Details
Benefits
- High power density
- Low assembly cost compared to through-hole devices
- Rugged body diode
Typical Applications
- OBC & DC/DC converters
- Fuel cell DC/DC converters
- Fuel cell inverters
- Onboard HVAC / Battery Thermal Management
- Powertrain inverters
- Auxiliary power supplies
Featured Resources
Technical Support
Featured Application Notes
Documents, Tools & Support
- Technical & Sales Documents
- Tools & Support
- Compliance
Documents
Document Type | Document Name | Last Updated |
|---|---|---|
| Application Notes | 02/2025 | |
| Application Notes | 09/2024 | |
| Application Notes | 07/2024 | |
| Application Notes | 01/2024 | |
| Application Notes | 12/2023 | |
| Application Notes | 11/2023 | |
| Application Notes | 01/2023 | |
| Application Notes | 09/2022 | |
| Product Catalog | 01/2025 | |
| Sales Sheets & Flyers | 07/2022 | |
| Sales Terms | 04/2025 | |
| Sales Terms | Power Product Packing & Shipping Reference Guide This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs.
| 03/2025 |