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Wolfspeed WolfPACK™ Silicon Carbide Power Module Family

Product shot of the Wolfspeed WolfPACK SiC Power Module in the GM3 package.
CAB008A12GM3T
1200 V, 8 mΩ, GM3, Half Bridge (AlN substrate) SiC Power Module with Pre-Applied Thermal Interface Material
Wolfspeed's CAB008A12GM3 is a baseplate-less power module in a half-bridge (AlN substrate) configuration with Pre-Applied Thermal Interface Material that meets the requirements of medium power applications, providing solutions across the power electronics continuum. Wolfspeed WolfPACK™ modules are a great choice for designers who want to increase efficiency and power density in a compact, industry standard footprint. The family of modules provide an excellent solution for fast design implementation, scalability, and lower assembly overhead.

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Wolfspeed WolfPACK™ Silicon Carbide Power Module Family

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Wolfspeed WolfPACK™ Silicon Carbide Power Module Family

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CAB008A12GM3T
New
GM3
Half Bridge (AlN substrate)
1200 V
181 A
8 mΩ
Gen 3 MOS
150 °C
62.8 mm x 56.7 mm
Yes
Industrial

Product Details

Features
  • Leading silicon carbide MOSFET technology in an industry standard form factor
  • Highest current rated topologies versus market equivalents
  • Built in NTC
  • Press-Fit connections
Benefits
  • Ease of layout and assembly
  • System scalability and reliability
  • Discrete design consolidated into a single package
  • Increased power density / reduced system size
Applications
  • EV Fast Charging
  • Industrial Power
  • UPS
  • Induction Heating Welding
  • Industrial Motor Drives
  • Power Supplies
  • Solar & Renewable Energy
  • DC/DC Converter

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This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
Sales Terms
Technical SupportPower Applications Forum

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Announcing the Newest Additions to the Wolfspeed WolfPACK™ Power Module Family

Read about the all new Wolfspeed WolfPACK™ power modules. These modules give designers scalability and efficiency along with maintaining the simplicity of the design.
Continue Reading  Technical Articles

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