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    Events

    Upcoming
    June 9 - 11, 2026

    PCIM 2026

    Nuremberg, Germany
    Event Details
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    Past Events

    Designer’s Guide To SiC 2025

    November 5 - 15, 2025
    Event Details

    ICSCRM 2025

    September 14 - 19, 2025
    Busan, South Korea
    Event Details

    Wolfspeed, Inc. Q3 FY25 Earnings Call

    Thursday, May 8, 2025
    Event Details

    PCIM 2025

    May 6 - 8, 2025
    Nuremberg, Germany
    Event Details

    Maximizing Performance of 1500 V DC Bus Applications with the 2300 V SiC Modules

    Wednesday, April 9, 2025
    Event Details

    APEC 2025

    March 16 - 20, 2025
    Atlanta, Georgia
    Event Details

    Wolfspeed, Inc. Q2 FY25 Earnings Call

    Wednesday, January 29, 2025
    Event Details

    CES 2025

    January 7 - 10, 2025
    Las Vegas, Nevada
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    UBS Global Technology and AI Conference

    Tuesday, December 3, 2024
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    Electronica 2024

    November 12 - 15, 2024
    München, Germany
    Event Details

    Wolfspeed, Inc. Q1 FY25 Earnings Call

    Wednesday, November 6, 2024
    Event Details

    Two Engineers, One SpeedVal™ Kit: Unlock the power of silicon carbide in Industrial Motor Drives with SpeedVal Kit

    Tuesday, October 29, 2024
    Event Details

    ECCE 2024

    October 20 - 24, 2024
    Phoenix, Arizona
    Event Details

    October 2024 Investor Update

    Tuesday, October 15, 2024
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    ICSCRM 2024

    September 29 - October 4, 2024
    Raleigh, North Carolina
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    Knowledge Center

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    PowerMakers:
    How Wolfspeed’s Fayetteville Team Turns Silicon Carbide Expertise into Customer Momentum

    At our Fayetteville site, Ty McNutt and his team don’t just solve for specs —they rethink systems. That’s the difference between supplying parts and becoming the partner customers rely on.
    Continue Reading  Thought Leadership

    Beyond Silicon’s Limits:
    How High‑Voltage Silicon Carbide is Redefining Critical Power

    Continue Reading  Thought Leadership

    Wolfspeed’s 300 mm Silicon Carbide Technology as a Materials Foundation for Next-Generation AI and HPC Advanced Packaging

    Continue Reading  Technical Articles

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