1200 V & 1700 V Half-Bridge Power Module Footprint Designed for Ultra-High Power Density
Wolfspeed has developed the HM power module platform to provide the benefits of Silicon Carbide (SiC) in power density sensitive applications; while maintaining the baseplate compatibility of a 62mm module. The HM platform’s Silicon Carbide optimized packaging enables 175°C continuous junction operation; with a high-reliability Silicon Nitride (Si3N4) power substrate to ensure mechanical robustness under extreme conditions and a lightweight AlSiC baseplate. The HM3 is a perfect fit for demanding applications such as industrial test equipment, medical power supplies, aerospace and traction drives.
Low Inductance (4.9 nH) Design to Enable High Speed Switching & High Efficiency with Reduced Losses
High Junction Temperature (175 °C) Operation
Configurations Available with both Second & Third Generation SiC MOSFETs
Lightweight AlSiC Baseplate
Silicon Nitride Insulator for Robust Thermal Cycling Capability
Benefits
Lightweight; Compact Form Factor with 62mm Compatible Baseplate Enables System Retrofit
Increased System Efficiency; due to Low Switching & Conduction Losses of Silicon Carbide
High-Reliability Material Selection enabling High-Temperature Operation
Applications
Railway & Traction
Solar & Renewable Energy
EV Chargers
Industrial Automation & Testing
Medical Power Supplies
Motor Drives
Documents, Tools & Support
Technical & Sales Documents
Tools & Support
Compliance
Documents
Document Type
Document Name
Last Updated
Application Notes
11/2021
Application Notes
01/2023
Application Notes
08/2023
Application Notes
03/2024
Application Notes
11/2023
Application Notes
01/2024
User Guide
01/2024
User Guide
01/2024
Design Files
06/2020
Data Sheets
01/2024
Data Sheets
01/2024
Data Sheets
01/2024
Data Sheets
01/2024
Data Sheets
01/2024
Data Sheets
01/2024
Data Sheets
01/2024
Data Sheets
01/2024
Videos
11/2023
Product Catalog
02/2024
Sales Sheets & Flyers
01/2023
Sales Sheets & Flyers
01/2024
Sales Sheets & Flyers
01/2024
Sales Terms
This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs
Data center cooling systems account for 20-45% of power consumed by data centers. The efficiency of these cooling systems can be improved with silicon carbide leading to up to 50% reduction in system losses.
Use the SpeedFit™ Design Simulator to simulate a solar MPPT Boost Converter and see how you can achieve high efficiency and power density in solar systems even under elevated temperatures.