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XM3 Half Bridge Power Module Family

XM3 Half-Bridge Power Module Family

Wolfspeed XM3 Power Module Family
1200V Half-Bridge Power Module Footprint Designed for SiC Power Density
SpeedFit Design SimulatorLTspice & PLECS Models

Wolfspeed has developed the XM3 power module platform to maximize the benefits of SiC; while keeping the module and system design robust; simple; and cost effective. With half the weight and volume of a standard 62 mm module; the XM3 power module maximizes power density while minimizing loop inductance and enabling simple power bussing. The XM3’s SiC optimized packaging enables 175°C continuous junction operation; with a high reliability Silicon Nitride (Si3N4) power substrate to ensure mechanical robustness under extreme conditions. The XM3 is a perfect fit for demanding applications such as EV chargers; UPS; and traction drives.

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Data Sheet
Package
Configuration
Blocking Voltage
Current Rating
RDS(ON) at 25°C
Generation
Maximum Junction Temperature
Module Size
Recommended For New Design?
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CAB450M12XM3
XM3
Half-Bridge
1200 V
450 A
2.6 mΩ
Gen 3 MOS
175 °C
80 x 53 x 19 mm
Yes
CAB400M12XM3
XM3
Half-Bridge
1200 V
400 A
4 mΩ
Gen 3 MOS
175 °C
80 x 53 x 19 mm
Yes
CAB425M12XM3
XM3
Half-Bridge
1200 V
425 A
3.2 mΩ
Gen 3 MOS
175 °C
80 x 53 x 19 mm
Yes
Product SKU
Buy Online
Request Sample
Data Sheet
Package
Configuration
Blocking Voltage
Current Rating
RDS(ON) at 25°C
Generation
Maximum Junction Temperature
Module Size
Recommended For New Design?
View Product
CAB450M12XM3
XM3
Half-Bridge
1200 V
450 A
2.6 mΩ
Gen 3 MOS
175 °C
80 x 53 x 19 mm
Yes
CAB400M12XM3
XM3
Half-Bridge
1200 V
400 A
4 mΩ
Gen 3 MOS
175 °C
80 x 53 x 19 mm
Yes
CAB425M12XM3
XM3
Half-Bridge
1200 V
425 A
3.2 mΩ
Gen 3 MOS
175 °C
80 x 53 x 19 mm
Yes
Features
  • High Power Density Footprint to Enable Incorporation of a Smaller Coldplate
  • High Temperature (175 °C) Operation
  • Low Inductance (6.7 nH) Design to Enable High Speed Switching & High Efficiency with Reduced Losses
  • Implements Third Generation SiC MOSFET Technology Optimized
Benefits
  • Offset Terminal Layout Simplifies Bus Bar Design
  • Integrated Temperature Sensing to Enable Global Temperature Assessment of Module Baseplate
  • Dedicated Drain-Kelvin Pin for Effective Dynamic Gate Voltage Control
  • Silicon Nitride Insulator for Robust Thermal Cycle Capability
  • Copper Baseplate for Improved Thermal Conductivity
Applications
  • Motor & Traction Drives
  • UPS
  • EV Chargers
  • Industrial Automation & Testing
  • Power Supplies
  • Motor Drives
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